FIRMANSYAH, F.; WAHYUDI, M.; PURNAMA, R. A. Virtual Link Aggregation Network Performance Using MikroTik Bonding. IAIC Transactions on Sustainable Digital Innovation (ITSDI), [S. l.], v. 2, n. 2, p. 131–139, 2021. DOI: 10.34306/itsdi.v2i2.394. Disponível em: https://aptikom-journal.id/index.php/itsdi/article/view/394. Acesso em: 17 sep. 2021.