[1]
Firmansyah, F., Wahyudi, M. and Purnama, R.A. 2021. Virtual Link Aggregation Network Performance Using MikroTik Bonding. IAIC Transactions on Sustainable Digital Innovation (ITSDI). 2, 2 (Apr. 2021), 131–139. DOI:https://doi.org/10.34306/itsdi.v2i2.394.